Compositions useful in electronic circuitry type applications, patternable using amplified light, and methods and compositions relating thereto

ABSTRACT

A light-activatable polymer composition and polymer composite includes a polymer binder selected from epoxy resins, silica filled epoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers, polyesters, polyphenylene oxide/polyphenylene ether resins, polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquid crystal polymers, polyamides, cyanate esters, or combinations thereof, the polymer binder being present in an amount from 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96, or 97 weight-percent of the total weight of the polymer composition; a spinel crystal filler present in an amount from 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 and 60 weight-percent of the total weight of the polymer composition, and methods for making same are provided.

FIELD OF INVENTION

The present invention relates generally to polymer compositions that canbe activated (e.g., induced to have a much greater reactivity favorableto metallization, relative to (such reactivity, if any) prior toactivation, using amplified light, such as, by means of a laser. Morespecifically, the compositions of the present invention comprise one ormore polymeric continuous domains in combination with a plurality ofdiscontinuous domains, the discontinuous domains comprising a type ofspinel crystalline material.

BACKGROUND INFORMATION

Electronic circuits may be made from rigid epoxy-metal laminates, usinga subtractive process. In such a process, a dielectric is first layered(or laminated) with a solid metal layer, and thereafter, the metal layeris converted to a metal circuit pattern by subtracting away most of themetal. This can result in a fine line conductive circuit pattern.Typically, the metal is removed by chemical etching. However, suchprocesses can be expensive, environmentally unfriendly, and increasinglyproblematic in meeting performance requirements of the industry.

EP 1 367 872 A2 to Goosey et al. is directed to laser activateddielectric material and an electroless metal deposition process,involving a sensitizing pre-dip and a milling process. The processincorporates titanium dioxide, aluminum nitride or zirconium dioxidefiller into a dielectric coating material, and then ultimatelyconverting the filler (using laser energy) into a metallizationcatalyst.

There remains a need for alternative materials, and processes, formaking light-activatable polymer compositions and polymer composites.

SUMMARY OF THE INVENTION

The present invention is directed to a light-activatable polymericcomposition comprising a polymeric type binder and a spinel crystal typefiller. The polymer binder comprises at least one or more of thefollowing types of polymer (including copolymers thereof): epoxies,bismaleimides, bismaleimide triazines, fluoropolymers, polyesters,polyphenylenes oxide/polyphenylene ethers, polybutadiene/polyisoprenecrosslinkable resins, liquid crystal polymers, polyamides and cyanateesters.

Depending upon the particular embodiment chosen, the polymer binder ispresent in an amount within a range between and including any two of thefollowing: 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96, and 97weight-percent, based upon the total weight of the light activatablepolymeric composition. The light activatable polymer composition furthercomprises a spinel crystal filler. Depending upon the particularembodiment chosen, the spinel crystal filler is present in an amountwithin a range between and including any two of the following: 3, 4, 5,6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 and60 weight-percent of the total weight of the light activateablepolymeric composition. Other optional ingredients can also beincorporated into the compositions of the present invention, such as,fillers, pigments, viscosity modifiers, and other additives common tothe above described polymer systems, provided however that (dependingupon the particular embodiment chosen) the total amount of optionalingredients does not exceed 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15,20, 25, 30, 35, 40, 45, 50, 55 or 60 weight-percent of the total weightof the light activateable polymer composition

Other features and advantages of the invention will be apparent from thefollowing detailed description as well as the claims. The foregoinggeneral description and the following detailed description are exemplaryand explanatory only, and are not intended to be restrictive of theinvention as defined in the appended claims.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

Definitions:

As used herein, the terms “comprises,” “comprising,” “includes,”“including,” “has,” “having” or any other variation thereof, areintended to cover a non-exclusive inclusion. For example, a composition,a film, a composite, process, method, article, or apparatus thatcomprises a list of elements is not necessarily limited to only thoseelements but may include other elements not expressly listed or inherentto such process, method, article, or apparatus. Further, unlessexpressly stated to the contrary, “or” refers to an inclusive or and notto an exclusive or. For example, a condition A or B is satisfied by anyone of the following: A is true (or present) and B is false (or notpresent), A is false (or not present) and B is true (or present), andboth A and B are true (or present). Also, use of the “a” or “an” areemployed to describe elements and components of the invention. This isdone merely for convenience and to give a general sense of theinvention. This description should be read to include one or at leastone and the singular also includes the plural unless it is obvious thatit is meant otherwise.

As used herein, the term “film” or “polymer film” describes the physicalform of the polymer composition, which may be flexible or rigid, and inroll or sheet form.

As used herein, the term “composition” or “polymer composition”describes a composition including various components, for example,spinel crystal filler(s) and polymer binder(s).

As used herein, the term “composite” describes a layered structurehaving at least one or more layers.

As used herein, the term “prepreg” means a woven glass orfiber-reinforced rigid dielectric layer with a partially cured B-stagepolymer composition or a fully cured C-stage polymer composition. Forexample, a composition according to an aspect of the invention isimpregnated into a woven glass structure to form a prepreg.

As used herein the terms FR4 and FR-5 are chemically specific epoxyresins in a glass reinforced matrix, for example, copper clad epoxyimpregnated glass fabric board in various grades classified by NationalElectrical Manufacturers Association (NEMA) which include FR4 and FR-5.

As used herein the term “adjacent” does not necessarily mean that alayer, member or structure is immediately next to another layer, memberor structure. A combination of layer(s), member(s) or structure(s) thatdirectly contact each other are still adjacent to each other.

As used herein, the term “DC” means digital circuitry.

As used herein, the term “functional layer” means a layer that hasfunctional characteristics including, but not limited to: thermallyconductive, dimensionally stable, adhesive, capacitive, resistive, andhigh frequency dielectric capability.

Unless otherwise defined, all technical and scientific terms used hereinhave the same meaning as commonly understood by one of ordinary skill inthe art to which this invention belongs. Although methods and materialssimilar or equivalent to those described herein can be used in thepractice or testing of the invention, suitable methods and materials aredescribed below. All publications, patent applications, patents, andother references mentioned herein are incorporated by reference in theirentirety. In case of conflict, the present specification, includingdefinitions, will control. In addition, the materials, methods, andexamples are illustrative only and not intended to be limiting.

Descriptions:

In one embodiment, the light-activatable polymer composition of thepresent invention includes a polymer binder selected from epoxy resins,silica filled epoxy, bismaleimide resins, bismaleimide triazines,fluoropolymers, polyesters, polyphenylene oxide/polyphenylene etherresins, polybutadiene/polyisoprene crosslinkable resins (andcopolymers), liquid crystal polymers, polyamides, cyanate esters, orcombinations thereof, and a spinel crystal filler. The polymer binder ispresent in an amount from 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90,95, 96 or 97 weight-percent of the total weight of the polymercomposition. The spinel crystal filler is present in an amount from 3,4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55and 60 weight-percent of the total weight of the polymer composition.

In another embodiment, a single-layer light-activatable polymercomposite, includes a polymer composition comprising at least 40, 45,50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96 or 97 weight-percent of apolymer binder selected from the group consisting of epoxy resins,silica filled epoxy, bismaleimide resins, bismaleimide triazines,fluoropolymers, polyesters, polyphenylene oxide/polyphenylene etherresins, polybutadiene/polyisoprene crosslinkable resins (andcopolymers), liquid crystal polymers, polyamides, cyanate esters, orcombinations thereof, and a spinel crystal filler. The weight percent ofthe spinel crystal filler, based on the total weight of the polymercomposition used in the layer; is at least 3, 4, 5, 6, 7, 8, 9, 10, 11,12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 or 60 weight-percent.

In another embodiment, a two-layer light-activatable polymer compositeincludes a first layer and a second layer; the first layer including acomposition that includes at least 40, 45, 50, 55, 60, 65, 70, 75, 80,85, 90, 95, 96 or 97 weight-percent of a polymer selected from epoxyresins, silica filled epoxy, bismaleimide resins, bismaleimidetriazines, fluoropolymers, polyesters, polyphenylene oxide/polyphenyleneether resins, polybutadiene/polyisoprene crosslinkable resins (andcopolymers), liquid crystal polymers, polyamides, cyanate esters, orcombinations thereof, the weight percent of the polymer binder based onthe total weight of the polymer composition used in the first layer;and, at least 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30,35, 40, 45, 50, 55 or 60 weight-percent spinel crystal filler based onthe total weight of the polymer composition used in the first layer, andthe second layer includes a functional layer.

In another embodiment, a three-layer light-activatable polymer compositeincludes two outer layers adjacent to an inner layer; the inner layer ispositioned between the two outer layers, wherein at least one of theouter layers includes a polymer composition that includes at least 40,45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96 or 97 weight-percent of apolymer binder selected from epoxy resins, silica filled epoxy,bismaleimide resins, bismaleimide triazines, fluoropolymers, polyesters,polyphenylene oxide/polyphenylene ether resins,polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquidcrystal polymers, polyamides, cyanate esters, or combinations thereof,the weight percent of the polymer binder based on the total weight ofthe polymer composition used in the one outer layer; and, at least 3, 4,5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 or60 weight-percent spinel crystal filler based on the total weight of thepolymer composition used in the one outer layer, and the inner layer(and optionally the other outer layer) is a functional layer.

In another embodiment, a process for making a light-activatable polymercomposition includes the steps of: dispersing a spinel crystal filler inan organic solvent to form a dispersion where the average particle sizeof the spinel crystal filler is between (and includes) any two of thefollowing numbers 50, 100, 300, 500, 800, 1000, 2000, 3000, 4000, 5000and 10000 nanometers; combining the dispersion with a polymer binderselected from epoxy resins, silica filled epoxy, bismaleimide resins,bismaleimide triazines, fluoropolymers, polyesters, polyphenyleneoxide/polyphenylene ether resins, polybutadiene/polyisoprenecrosslinkable resins (and copolymers), liquid crystal polymers,polyamides, cyanate esters, or combinations thereof, to form a polymercomposition; applying the polymer composition onto a portion of a flatsurface to form a layer, and applying thermal energy to the layer toform a polymer composite.

In another embodiment, a process in accordance with the presentinvention further includes light-activating a portion of the polymercomposite with a laser beam to form a light activated pattern on asurface of the composite, and metal plating the light activated patternof the polymer composite using an electroless (or conceivably anelectrolytic) plating bath to form electrically conductive pathways onthe light activated pattern. In one embodiment, a light-activatablepolymer composition includes a polymer binder selected from a groupconsisting of: epoxy resins, silica filled epoxy, bismaleimide resins,bismaleimide triazines, fluoropolymers, polyesters, polyphenyleneoxide/polyphenylene ether resins, polybutadiene/polyisoprenecrosslinkable resins (and copolymers), liquid crystal polymers,polyamides, cyanate esters, or combinations thereof, the polymer binderbeing present in an amount from 40, 45, 50, 55, 60, 65, 70, 75, 80, 85,90, 95, 96 or 97 weight-percent of the total weight of the polymercomposition; and a spinel crystal filler present in an amount from 3, 4,5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55and 60 weight-percent of the total weight of the polymer composition.The polymer composition has a visible-to-infrared light extinctioncoefficient between and including any two of the following numbers 0.05,0.06, 0.07, 0.08, 0.09, 0.1, 0.2, 0.3, 0.4, 0.5, and 0.6 per micron. Thespinel crystal filler is represented by the chemical formula AB₂O₄ orBABO₄. The A component of the formulas is a metal cation having avalence of 2 and is selected from the group consisting of cadmium, zinc,copper, cobalt, magnesium, tin, titanium, iron, aluminum, nickel,manganese, chromium, and combinations of two or more of these. The Bcomponent of the formulas is a metal cation having a valence of 3 and isselected from the group consisting of cadmium, manganese, nickel, zinc,copper, cobalt, magnesium, tin, titanium, iron, aluminum, chromium, andcombinations of two or more of these.

Alternatively, the A component is an element from the periodic tableselected from the group consisting of cadmium, chromium, manganese,nickel, zinc, copper, cobalt, iron, magnesium, tin, titanium, andcombinations of two or more of these, and the B component is an elementfrom the periodic table selected from the group consisting of chromium,iron, aluminum, nickel, manganese, tin, and combinations of two or moreof these.

The spinel crystal filler can have an average particle size between andincluding any two of the following numbers 50, 100, 300, 500, 800, 1000,2000, 3000, 4000, 5000 and 10000 nanometers.

The composition may be impregnated into a glass structure to form aprepreg, may be impregnated into a fiber structure, or may be in theform of a film.

The film composites of the present invention may have a thicknessbetween and including any two of the following numbers 1, 2, 3, 4, 5, 7,8, 9, 10, 12, 14, 16, 18, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70,75, 80, 85, 90, 95, 100, 125, 150, 175 and 200 microns.

In another embodiment, a single-layer light-activatable polymercomposite includes a polymer composition comprising at least 40, 45, 50,55, 60, 65, 70, 75, 80, 85, 90, 95, 96, or 97 weight-percent of apolymer binder selected from the group consisting of epoxy resins,silica filled epoxy, bismaleimide resins, bismaleimide triazines,fluoropolymers, polyesters, polyphenylene oxide/polyphenylene etherresins, polybutadiene/polyisoprene crosslinkable resins (andcopolymers), liquid crystal polymers, polyamides, cyanate esters, orcombinations thereof, the weight percent of the polymer binder based onthe total weight of the polymer composition used in the first layer;and, at least 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30,35, 40, 45, 50, 55 or 60 weight-percent spinel crystal filler based onthe total weight of the polymer composition. The single layer polymercomposite can have a visible-to-infrared light extinction coefficientbetween and including any two of the following numbers 0.05, 0.06, 0.07,0.08, 0.09, 0.1, 0.2, 0.3, 0.4, 0.5, and 0.6 per micron. The singlelayer polymer composite includes a polymer binder, which can be an epoxyresin, bismaleimide resin, bismaleimide triazine, a fluoropolymer,polyester, a liquid crystal polymer, a polyamide, or a cyanate ester.

In another embodiment, a two-layer light activatable polymer compositeincludes a first layer and a second layer; the first layer comprising acomposition comprising at least 40, 45, 50, 55, 60, 65, 70, 75, 80, 85,90, 95, 96 or 97 weight-percent of a polymer binder selected from thegroup consisting of epoxy resins, silica filled epoxy, bismaleimideresins, bismaleimide triazines, fluoropolymers, polyesters,polyphenylene oxide/polyphenylene ether resins,polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquidcrystal polymers, polyamides, cyanate esters, or combinations thereof,the weight percent of the polymer binder based on the total weight ofthe polymer composition used in the first layer; and, at least 3, 4, 5,6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 or 60weight-percent spinel crystal filler based on the total weight of thepolymer composition used in the first layer, and the second layercomprises a functional layer. The first layer may be in the form of afilm or a prepreg. The first layer can have a visible-to-infrared lightextinction coefficient between and including any two of the followingnumbers 0.05, 0.06, 0.07, 0.08, 0.09, 0.1, 0.2, 0.3, 0.4, 0.5, and 0.6per micron. The second functional layer may be in the form of a film orprepreg. The second functional layer may also be a thermal conductionlayer, a capacitor layer, a resistor layer, a dimensionally stabledielectric layer, or an adhesive layer.

In another embodiment, a three-layer light-activatable polymer compositeincludes two outer layers adjacent to an inner layer; the inner layerpositioned between the two outer layers, wherein at least one of theouter layers comprises a polymer composition comprising at least 40, 45,50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96 or 97 weight-percent of apolymer binder selected from the group consisting of epoxy resins,silica filled epoxy, bismaleimide resins, bismaleimide triazines,fluoropolymers, polyesters, polyphenylene oxide/polyphenylene etherresins, polybutadiene/polyisoprene crosslinkable resins (andcopolymers), liquid crystal polymers, polyamides, cyanate esters, orcombinations thereof, the weight percent of the polymer binder based onthe total weight of the polymer composition used in the first layer;and, at least 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30,35, 40, 45, 50, 55 or 60 weight-percent spinel crystal filler based onthe total weight of the polymer composition used in the first layer, andwherein in the inner layer (and optionally one of the outer layers)comprises a functional layer like a film or prepreg.

In another embodiment, a process for making a light-activatable polymercomposition comprises the steps of: dispersing a spinel crystal fillerin an organic solvent to form a dispersion, wherein the average particlesize of the spinel crystal filler is between any two of the followingnumbers 50, 100, 300, 500, 800, 1000, 2000, 3000, 4000, 5000 and 10000nanometers; combining the dispersion with a polymer binder selected fromthe group consisting of epoxy resins, silica filled epoxy, bismaleimideresins, bismaleimide triazines, fluoropolymers, polyesters,polyphenylene oxide/polyphenylene ether resins,polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquidcrystal polymers, polyamides, cyanate esters, or combinations thereof,to form a polymer composition; applying the polymer composition onto aportion of a flat surface to form a layer; and applying thermal energyto the layer to cure the polymer composition. The thermally exposedpolymer composition may have a visible-to-infrared light extinctioncoefficient between and including any two of the following numbers 0.05,0.06, 0.07, 0.08, 0.09, 0.1, 0.2, 0.3, 0.4, 0.5, and 0.6 per micron. Theprocess may further include the steps of: light-activating a portion ofthe polymer composition with a laser beam to form light activatedpattern on a surface of the composition, and metal plating the lightactivated pattern of the polymer composition using an electroless (orelectrolytic) plating bath to form electrically conductive pathways onthe light activated portions.

In yet another embodiment, a circuit board incorporates the polymercomposition. The compositions may also be incorporated into a componentselected from an integrated circuit package, an interconnect in a pingrid array, a multi-chip module, a chip-scale package, a ball gridarray, a radio frequency module, a digital module, chip-on-flex, astacked via substrate, a printed circuit board having embedded passivedevices, a high density interconnect circuit board, an “LGA” Land gridarray, an “SOP” (System-on Package) Module, a “QFN” Quad Flat package-NoLeads, and a “FC-QFN” Flip Chip Quad Flat package-No leads, a componentused in a high density interconnect, including a wafer scale package, atape automated bonding circuit package, a chip-on-flex circuit package,or a chip-on-board electronic circuit package.

The compositions of the present invention may optionally furthercomprise an additive selected from the group consisting of anantioxidant, a light stabilizer, a light extinction coefficientmodifier, a flame retardant additive, an anti-static agent, a heatstabilizer, a reinforcing agent, an ultraviolet light absorbing agent,an adhesion promoter, an inorganic filler, for example, silica, asurfactant or dispersing agent, or combinations thereof. Lightextinction coefficient modifiers include, but are not limited to, carbonpowder or graphite powder.

The polymer compositions of the invention have dispersed therein highlylight activatable spinel crystal fillers, where the fillers comprise twoor more metal oxide cluster configurations within a definable crystalformation. The overall crystal formation, when in an ideal (i.e.,non-contaminated, non-derivative) state, has the following generalformula:AB₂O₄

Where:

-   -   i. A (in one embodiment, A is a metal cation having primarily,        if not exclusively, a valance of 2) is selected from a group        including cadmium, chromium, manganese, nickel, zinc, copper,        cobalt, iron, magnesium, tin, titanium, and combinations        thereof, which provides the primary cation component of a first        metal oxide cluster (“metal oxide cluster 1”) typically a        tetrahedral structure,    -   ii. B (in one embodiment, B is a metal cation having primarily,        if not exclusively, a valance of 3) is selected from the group        including chromium, iron, aluminum, nickel, manganese, tin, and        combinations thereof and which provides the primary cation        component of a second metal oxide cluster (“metal oxide cluster        2”) typically an octahedral structure,    -   iii. where within the above groups A or B, any metal cation        having a possible valence of 2 can be used as an “A”, and any        metal cation having a possible valence of 3 can be used as a        “B”,    -   iv. where the geometric configuration of “metal oxide cluster 1”        (typically a tetrahedral structure) is different from the        geometric configuration of “metal oxide cluster 2” (typically an        octahedral structure),    -   v. where a metal cation from A and B can be used as the metal        cation of “metal oxide cluster 2” (typically the octahedral        structure), as in the case of an ‘inverse’ spinel-type crystal        structure,    -   vi. where O is primarily, if not exclusively, oxygen; and    -   vii. where the “metal oxide cluster 1” and “metal oxide cluster        2” together provide a singular identifiable crystal type        structure having heightened susceptibility to electromagnetic        radiation evidenced by the following property, when dispersed in        a polymer-based dielectric at a loading of about 10 to about 30        weight percent, a “visible-to-infrared light” extinction        coefficient can be measure to be between and including any two        of the following numbers, 0.05, 0.06, 0.07, 0.08, 0.09, 0.1,        0.2, 0.3, 0.4, 0.5 and 0.6 per micron.

The spinel crystal fillers can be dispersed in a polymer bindersolution. The polymer binder solution includes epoxy resins, silicafilled epoxy, bismaleimide resins, bismaleimide triazines,fluoropolymers, polyesters, polyphenylene oxide/polyphenylene etherresins, polybutadiene/polyisoprene crosslinkable resins (andcopolymers), liquid crystal polymers, polyamides, cyanate esters, orcombinations thereof, dissolved in a solvent. The fillers are typicallydispersed at a weight-percent between and including any two of thefollowing numbers 3, 5, 7, 9, 10, 12, 15, 20, 25, 30, 35, 40, 45, 50, 55and 60 weight-percent of the polymer, and initially have an averageparticle size (after incorporation into the polymer binder) of betweenand including any two of the following numbers 50, 100, 300, 500, 800,1000, 2000, 3000, 4000, 5000 and 10000 nanometers.

The spinel crystal fillers can be dispersed in an organic solvent(either with or without the aid of a dispersing agent) and in asubsequent step, dispersed in a polymer binder solution to form ablended polymer composition. The blended polymer composition can then becast onto a flat surface (or drum), heated, dried, and cured orsemi-cured to form a polymer film with a spinel crystal filler dispersedtherein.

The polymer film can then be processed through a light activation stepby using a laser beam. The laser beam can be focused, using opticalelements, and directed to a portion of the surface of the polymer filmwhere a circuit-trace, or other electrical component, is desired to bedisposed. Once selected portions of the surface are light-activated, thelight-activated portions can be used as a path (or sometimes a spot) fora circuit trace to be formed later, by a metal plating step for example,an electroless plating step.

The number of processing steps employed to make a circuit using thepolymer film or polymer composites are often far fewer relative to thenumber of steps in the subtractive processes presently employed in theindustry today.

In one embodiment, the polymer compositions and polymer composites havea visible-to-infrared light extinction coefficient of between andincluding any two of the following numbers 0.05, 0.06, 0.07, 0.08, 0.09,0.1, 0.2, 0.3, 0.4, 0.5, and 0.6 per micron (or 1/micron).Visible-to-infrared light is used to measure a light extinctioncoefficient for each film. The thickness of the film is used in thecalculations for determining the light extinction coefficient.

As used herein, the visible-to-infrared light extinction coefficient(sometimes referred to herein to simply as ‘alpha’) is a calculatednumber. This calculated number is found by taking the ratio of measuredintensity of a specific wavelength of light (using a spectrometer) afterplacing a sample of the composite film in a light beam path, anddividing that number by the light intensity of the same light throughair.

If one takes the natural log of this ratio and multiplies it by (−1),then divides that number by the thickness of the film (measured inmicrons), a visible-to-infrared light extinction coefficient can becalculated.

The general equation for the visible-to-infrared light extinctioncoefficient is then represented by the general formula:Alpha =−1×[ln(I(X)/I(O))]/t

-   -   where I(X) represents the intensity of light transmitted through        a film,    -   where I(O) represents the intensity of light transmitted through        air, and    -   where t represents the thickness of a film.

Typically, the film thickness in these calculations is expressed inmicrons. Thus, the light extinction coefficient (or alpha number) for aparticular film is expressed as 1/microns, or inverse microns (e.g.,microns⁻¹). Particular wavelengths of light useful in the measurementsdiscussed herein are typically those wavelengths of light covering thevisible-to-infrared light portion of the spectrum.

The polymer compositions and polymer composites comprise spinel crystalfillers, substantially homogeneously dispersed, in a polymer bindersolution in an amount within a range between (and including) any two ofthe following weight-percentages 3, 4, 5, 6, 7, 8, 9, 10, 12, 15, 18,20, 24, 25, 28, 30, 32, 34, 35, 36, 38, 40, 42, 44, 46, 48, 50, 52, 54,56, 58 and 60 weight-percent. Polymer composites containing too muchspinel crystal filler can sometimes be too brittle to handle indownstream processing as the composites tend to lose flexibility withhigher loadings of filler.

In one embodiment, the spinel crystal fillers are represented by thegeneral formula:AB₂O₄where A is a metal cation typically having a valence 2, and is selectedfrom a group comprising cadmium, chromium, manganese, nickel, zinc,copper, cobalt, iron, magnesium, tin, titanium, and combinations of twoor more of these, and where B is a metal cation typically having avalence of 3, and is selected from the group comprising chromium, iron,aluminum, nickel, manganese, tin, and combinations of two or more ofthese, and where O is primarily, if not in all cases, oxygen.

In one embodiment, the metal cation A provides the primary cationcomponent of a first metal oxide cluster, “metal oxide cluster 1”(typically a tetrahedral structure) of a spinel structure. Metal cationB provides the primary cation component of a second metal oxide cluster,“metal oxide cluster 2” (typically an octahedral structure).

In another embodiment, within the above groups A and B, any metal cationhaving a possible valence of 2 can be used as an “A” cation. Inaddition, any metal cation having a possible valence of 3 can be used asa “B” cation provided that the geometric configuration of “metal oxidecluster 1” is different from the geometric configuration of “metal oxidecluster 2”.

In yet another embodiment, A and B can be used as the metal cation of“metal oxide cluster 2” (typically the octahedral structure). This istrue in the particular case of an ‘inverse’ spinel-type crystalstructure typically having the general formula B(AB)O₄.

In one or more steps, a polymer binder is solvated to a sufficiently lowviscosity (typically, a viscosity of less than 50, 40, 30, 20, 15, 10,9, 8, 7, 6, 5, 4, 3, 2, 1.5, 1, 0.5, 0.1, 0.05, and 0.001 kilopoise) toallow the spinel crystal filler (which can also be suspendable in asimilar or the same solvent) to be adequately dispersed within thepolymer binder solution. The dispersion of the spinel crystal filler isconducted in such a manner as to avoid undue agglomeration of theparticles in the solution or the dispersion. Unwanted agglomeration ofthe filler particles can cause unwanted interfacial voids, or otherproblems in the polymer composite.

The spinel crystal filler particles can be dispersed in the polymerbinder solution directly, or can be dispersed in a solvent prior todispersion in the polymer binder solution. The filler particles can bemixed in a solvent to form a dispersion, until the particles havereached an average particle size of between any two of the followingnumbers 50, 100, 300, 500, 800, 1000, 2000, 3000, 4000, 5000, and 10000nanometers. The dispersion may then be mixed using a high-speed, orhigh-shear, mixing apparatus. Spinel crystal filler may be dispersedusing various suitable solvents. In some cases, the dispersions may alsoinclude one or more suitable dispersing agents known to a skilledartisan for assistance in forming a stable dispersion, particularly forcommercial scale production.

The spinel crystal fillers dispersed in the polymer binder solutiongenerally have an average particle size between and including any two ofthe following numbers 50, 100, 200, 250, 300, 350, 400, 450, 500, 1000,2000, 3000, 4000, 5000 and 10000 nanometers. Generally, at least 80, 85,90, 92, 94, 95, 96, 98, 99 or 100 percent of the dispersed spinelcrystal filler is within the above size range(s). Crystal size, in thepolymer binder solution, can be determined by a laser particle analyzer,such as an LS130 particle size analyzer with small volume module made byCOULTER@.

The polymer binder solution and the spinel crystal filler particles arecombined to form a relatively uniform dispersion of the composition. Thecomposition may then be converted as described below into a polymercomposite where the solids content is typically greater than 98.0, 98.5,99.0 or 99.5 weight-percent.

Because some spinel crystal fillers are easily dispersed in a polymerbinder solution, with little or no additional shearing force required,slurries formed can contain often fewer than 100, 50, 20, 10, 8, 6, 5,4, 3, 2, or 1 parts per million (ppm) undesired agglomerates.Undesirable agglomerates are defined as a collection of bound(adjoining) spinel crystal fillers having an average particle size ofgreater than 10, 11, 12, 13, 14, or 15 microns. However, some spinelcrystal fillers may require some milling or filtration to break upunwanted particle agglomeration for adequately dispersing nano-sizedfillers into a polymer. Milling and 30, filtration can be costly, andmay not satisfactorily remove all unwanted agglomerates. Thus, in oneembodiment, the spinel crystal filler is dispersible, and suspendable,at 20 weight-percent in a (at least 99 weight-percent pure)dimethylacetamide solvent. After dispersing and suspending the spinelcrystal filler into a solvent (optionally with the aid of a high-shearmechanical mixer) less than 15, 10, 8, 6, 4, 2 or 1 weight-percent ofthe filler particles by weight can precipitate out of solution when thesolution was kept at rest for 72 hours at 20° C.

The present invention employs the use of a selected group of spinelcrystal fillers to allow for efficient and accurate surface patterningthrough activation by a laser (or other similar type light patterningtechnique) prior to bulk metallization of the pattern formed by thelaser.

In one embodiment, a light extinction coefficient modifier can be addedas a partial substitute for some, but not all, of the spinel crystalfiller. Appropriate amounts of substitution can range from, between andincluding any two of the following numbers, 1, 2, 3, 4, 5, 10, 15, 20,25, 30, 35, or 40 weight percent of the total amount of spinel crystalfiller component. In one embodiment, about 10 weight percent of thespinel crystal filler can be substituted with a carbon powder orgraphite powder. The polymer composite formed therefrom should have asufficient amount of spinel crystal structure present in the polymercomposite to allow metal ions to plate effectively on the surfacethereof, while the above mentioned amount of substitute (e.g., carbonpowder) darkens the polymer composite sufficiently enough so that the asufficient amount of light energy (i.e., an amount of light energy thateffectively light activates the surface of the composite) can beabsorbed.

A specific range of useful light extinction coefficients has beenadvantageously found for the polymer compositions and polymercomposites. Specifically, it was found that the polymer compositions andpolymer composites require a sufficient degree of light-absorptioncapability to work effectively in high-speed light activation stepstypically employing the use of certain laser machines.

For example, in one type of light-activation step employed (e.g., a stepemploying the use of a laser beam) it was found that the polymercompositions and composites of the present invention are capable ofabsorbing a significant amount of light energy so that a well-definedcircuit trace pattern can be formed thereon. This can be done in arelatively short time. Conversely, commercially available polymer films(i.e., films without these particular fillers, or films containingnon-functional spinel crystal fillers) may take longer, have too low alight extinction coefficient, and may not be capable of light-activatingin a relatively short period, if at all. Thus, many polymer films, evenfilms containing relatively high loadings of other types of spinelcrystal fillers, may be incapable of absorbing enough light energy to beuseful in high-speed, light activation manufacturing, as well as beingable to receive plating of a metal in well-defined circuit patterns.

A wide range of polymer binders suitable for use in the embodiments ofthe invention include epoxy resins, silica filled epoxy, bismaleimideresins, bismaleimide triazines, fluoropolymers, polyesters,polyphenylene oxide/polyphenylene ether resins,polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquidcrystal polymers, polyamides, cyanate esters, or combinations thereof.The polymer binders may include an inorganic filler, for example, silicaor alumina. A wide range of polymer binders was found to be particularlyuseful in the preparation of the polymer compositions and composites.

Useful organic solvents for the preparation of the polymer binders ofthe invention should be capable of dissolving the polymer binders. Asuitable solvent should also have a suitable boiling point, for example,below 225° C., so the polymer solution can be dried at moderate (i.e.,more convenient and less costly) temperatures. A boiling point of lessthan 210, 205, 200, 195, 190, 180, 170, 160, 150, 140, 130, 120 and 110°C. is suitable.

As described above, suitable polymer binders for use in the embodimentsof the invention include epoxy resins, silica filled epoxy, bismaleimidetriazine (BT), fluoropolymers, polyesters, polyphenyleneoxide/polyphenylene ether resins, polybutadiene/polyisoprenecrosslinkable resins (and copolymers), liquid crystal polymers,polyamides, and cyanate esters.

Epoxy resins are thermoplastic materials which can be cured to athermoset polymer. Major resin types include diglycidyl ethers ofbisphenol A, novolacs, peracid resins, and hydantoin resins, amongothers. There are many epoxy resin suppliers in the world and the mostrecognizable trade names include Araldite, DER, Epi-Cure, Epi-Res,Epikote, Epon, Epotuf, each of which provide a wide range of propertiesdepending on the formulation and processing. Additional components mayalso be added to an epoxy resin and curing agent formulation. Thesecomponents include, but are not limited to, diluents, resinous modifiersto affect flexibility, toughness or peel strength, adhesion fillers,colorants, dyes, rheological additives, and flame retardants.

In one embodiment, the polymer binder may include an epoxy resin.Examples of suitable epoxy resins, include, but are not limited to,glycidyl ether type epoxy resin, glycidyl ester resin and glycidylaminetype epoxy resin. In addition, any silica or alumina-filled epoxies arealso suitable.

Examples of suitable glycidyl ether type epoxy resins include, but arenot limited to: bisphenol A type, bisphenol F type, brominated bisphenolA type, hydrogenated bisphenol A type, bisphenol S type, bisphenol AFtype, biphenyl type, naphthalene type, fluorene type, phenol novolactype, cresol novolac type, DPP novolac type, trifunctional type,tris(hydroxyphenyl)methane type, and tetraphenylolethane type epoxyresins.

Examples of suitable glycidyl ester type epoxy resins include, but arenot limited to: hexahydrophthalate type and phthalate type epoxy resins.

Examples of suitable glycidylamine type epoxy resins include, but arenot limited to: tetraglycidyldiaminodiphenylmethane, triglycidylisocyanurate, hydantoin type,1,3-bis(N,N-diglycidylaminomethyl)cyclohexane, aminophenol type, anilinetype, and toluidine type epoxy resins.

In one embodiment, the polymer binder may include a polyester. Examplesof suitable polyesters include, but are not limited to: polyethyleneterephthalate, polybutylene terephthalate,poly(trimethylene)terephthalate, etc., poly(e-caprolactone),polycarbonate, poly(ethylene-2,6-naphthalate), poly(glycolic acid),poly(4-hydroxy benzoic acid)-co-poly(ethyleneterephthalate) (PHBA), andpoly(hydroxybutyrate).

In another embodiment, the polymer binder may include a polyamide.Examples of suitable aliphatic polyamides include, but are not limitedto: nylon 6, nylon 6,6, nylon 6,10 and nylon 6,12, nylon 3, nylon 4,6and copolymers thereof are useful with this invention. Examples ofaliphatic aromatic polyamides include, but are not limited to, nylon 6T(or nylon 6(3)T), nylon 10T and copolymers thereof, nylon 11, nylon 12and nylon MXD6 are also suitable for use with this invention. Examplesof aromatic polyamides include, but are not limited to, poly(p-phenyleneterephthalamide), poly(p-benzamide), and poly(m-phenyleneisophthalamide) are also suitable for use with this invention.

In another embodiment, the polymer binder may include a fluoropolymer.The term fluoropolymer is intended to mean any polymer having at leastone, if not more, fluorine atoms contained within the repeating unit ofthe polymer structure. The term fluoropolymer, or fluoropolymercomponent, is also intended to mean a fluoropolymer resin (i.e. afluoro-resin). Commonly, fluoropolymers are polymeric materialcontaining fluorine atoms covalently bonded to, or with, the repeatingmolecule of the polymer. Suitable fluoropolymer components include, butare not limited to:

-   -   1. “PFA”, a poly(tetrafluoroethylene-co-perfluoro[alkyl vinyl        ether]), including variations or derivatives thereof, having the        following moiety representing at least 50, 60, 70, 80, 85, 90,        95, 96, 97, 98, 99 or about 100 weight percent of the entire        polymer:    -    where R₁ is C_(n)F_(2n+1), where n can be any natural number        equal to or greater than 1 including up to 20 or more, typically        n is equal to 1 to three, where x and y are mole fractions,        where x is in a range from 0.95 to 0.99, typically 0.97, and        where y is in a range from 0.01 to 0.05, typically 0.03, and        where the melt flow rate, described in ASTM D 1238, is in a        range of from 1 to 100 (g/10 min.), preferably 1 to 50 (g/10        min.), more preferably, 2 to 30 (g/10 min.), and most preferably        5 to 25 (g/10 min.).    -   2. “FEP”, a poly(tetrafluoroethylene-co-hexafluoropropylene)        [a.k.a. poly(tetrafluoroethylene-co-hexafluoropropylene)        copolymer], derived in whole or in part from tetrafluoroethylene        and hexafluoropropylene, including variations or derivatives        thereof, having the following moiety representing at least 50,        60, 70, 80, 85, 90, 95, 96, 97, 98, 99 or about 100 weight        percent of the entire polymer:    -    where x and y are mole fractions, where x is in a range from        0.85 to 0.95, typically 0.92, and where y is in a range from        0.05 to 0.15, typically 0.08, and where the melt flow rate,        described in ASTM D 1238, is in a range of from 1 to 100 (g/10        min.), preferably 1 to 50 (g/10 min.), more preferably, 2 to 30        (g/10 min.), and most preferably 5 to 25 (g/10 min.). The FEP        copolymer can be derived directly or indirectly from: (i.) 50,        55, 60, 65, 70 or 75 percent to about 75, 80, 85, 90 or 95        percent tetrafluoroethylene; and (ii.) 5, 10, 15, 20, or 25        percent to about 25, 30, 35, 40, 45 or 50 percent (generally 7        to 27 percent) hexafluoropropylene. Such FEP copolymers are well        known and are described in U.S. Pat. Nos. 2,833,686 and        2,946,763.    -   3. “PTFE”, a polytetrafluoroethylene, including variations or        derivatives thereof, derived in whole or in part from        tetrafluoroethylene and having the following moiety representing        at least 50, 60, 70, 80, 85, 90, 95, 96, 97, 98, 99 or about 100        weight percent of the entire polymer: where x is equal to any        natural number between 50 and 500,000.    -   4. “ETFE”, a poly(ethylene-co-tetrafluoroethylene), including        variations or derivatives thereof, derived in whole or in part        from ethylene and tetrafluoroethylene and having the following        moiety representing at least 50, 60, 70, 80, 85, 90, 95, 96, 97,        98, 99, or about 100 weight percent of the entire polymer:    -    where x and y are mole fractions, where x is in a range from        0.40 to 0.60, typically 0.50, and where y is in a range from        0.40 to 0.60, typically 0.50, and where the melt flow rate,        described in ASTM D 1238, is in a range of from 1 to 100 (g/10        min.), preferably 1 to 50 (g/10 min.), more preferably, 2 to 30        (g/10 min.), and most preferably 5 to 25 (g/10 min.).

Advantageous characteristics of fluoropolymer resins includehigh-temperature stability, resistance to chemical attack, advantageouselectrical properties (high-frequency properties in particular) lowfriction properties, and low tackiness. Other potentially usefulfluoropolymer resins include the following:

-   -   1. chlorotrifluoroethylene polymer (CTFE);    -   2. tetrafluoroethylene chlorotrifluoroethylene copolymer        (TFE/CTFE);    -   3. ethylene chlorotrifluoroethylene copolymer (ECTFE);    -   4. polyvinylidene fluoride (PVDF);    -   5. polyvinylfluoride (PVF); and    -   6. Teflon® AF (sold by E.I. du Pont de Nemours & Co.).

In yet another embodiment, the polymer binder may include a liquidcrystal polymer or thermotropic liquid crystal polymer. Liquid crystalpolymers generally include a fusible or melt processible polyamide orpolyester. Liquid crystal polymers also include, but are not limited to,polyesteramides, polyesterimides, and polyazomethines. Suitable liquidcrystal polymers are described by Jackson et al. in U.S. Pat. Nos.4,169,933, 4,242,496 and 4,238,600, as well as in “Liquid CrystalPolymers VI: Liquid Crystalline Polyesters of SubstitutedHydroquinones.” The term “thermotropic” means a polymer that when testedby the TOT test as described in U.S. Pat. No. 4,075,262 transmits lightthrough crossed polarizers and is thus considered to form an anisotropicmelt. Suitable liquid crystal polymers are described, for example inU.S. Pat. Nos. 3,991,013; 3,991,014; 4,011,199; 4,048,148; 4,075,262;4,083,829; 4,118,372; 4,122,070; 4,130,545; 4,153,779; 4,159,365;4,161,470; 4,169,933; 4,184,996; 4,189,549; 4,219,461; 4,232,143;4,232,144; 4,245,082; 4,256,624; 4,269,965; 4,272,625; 4,370,466;4,383,105; 4,447,592; 4,522,974; 4,617,369; 4,664,972; 4,684,712;4,727,129; 4,727,131; 4,728,714; 4,749,769; 4,762,907; 4,778,927;4,816,555; 4,849,499; 4,851,496; 4,851,497; 4,857,626; 4,864,013;4,868,278; 4,882,410; 4,923,947; 4,999,416; 5,015,721; 5,015,722;5,025,082; 5,1086,158; 5,102,935; 5,110,896 and U.S. Pat. No. 5,143,956;and European Patent Application 356,226. Commercial examples of liquidcrystal polymers include the aromatic polyesters or poly(ester-amides)sold under the trademarks Zenite® (DuPont), VECTRA® (Hoechst), andXYDAR® (Amoco).

In another embodiment, the polymer binders of the present invention mayinclude a cyanate ester. An example of a suitable cyanate esterincludes, but is not limited to, dicyanobisphenol A and 4,4′-isopropylbis(phenyl cyanate). Modification of this basic structure can be used toprovide various engineering properties, including but not limited totoughness, rigidity, and elevated glass transition temperature. Uponheating these monomers, prepolymers are obtained, which are typicallytriazine resins. Upon further heating highly crosslinked polycyanurateis formed with a glass transition temperature in the 240-290° C. range.The resins may be used by themselves or in blends with epoxy. Forcertain electronic applications, at least three polymers based oncyanate esters are used: a cyanate ester homopolymer, a copolymer ofcyanate ester with bismaleimide (known as a bismaleimide triazine (BT)resin), and bismaleimide.

The polymer binders of the present invention, when dissolved in asuitable solvent to form a polymer binder solution (and/or castingsolution), may also contain one or more additives. These additivesinclude, but are not limited to, processing aids, antioxidants, lightstabilizers, light extinction coefficient modifiers, flame retardantadditives, anti-static agents, heat stabilizers, ultraviolet lightabsorbing agents, inorganic fillers, for example, silicon oxides,adhesion promoters, reinforcing agents, and a surfactant or dispersingagent, and combinations thereof.

The polymer solution can be cast or applied onto a support, for example,an endless belt or rotating drum, to form a film layer. Thesolvent-containing film layer can be converted into a self-supportingfilm by baking at an appropriate temperature (which may be thermalcuring) or simply by drying (or partial drying known as “B-stage”) whichproduces a substantially dry film. Substantially dry film, as usedherein, is a defined as a film with less than 2, 1.5, 1.0, 0.5, 0.1,0.05, and 0.01 weight-percent volatile (e.g., solvent or water)remaining in the polymer composite. In addition, thermoplastic polymercompositions, having the spinel crystal filler dispersed therein, can beextruded to form either a film or any other pre-determined shapedarticle.

In one embodiment, a polymer film (polymer composite) is made having athickness of between, and including, any two of the following numbers 1,2, 3, 4, 5, 7, 8, 9, 10, 12, 14, 16, 18, 20, 25, 30, 35, 40, 45, 50, 55,60, 65, 70, 75, 80, 85, 90, 95, 100, 125, 150, 175 and 200 microns. Whenthe spinel crystal fillers are dispersed in a polymer binder, forexample, at a loading level of about 10 to about 30 weight percent, a“visible-to-infrared light” extinction coefficient is measured to be,between and including any two of the following numbers, 0.05, 0.06,0.07, 0.08, 0.09, 0.1, 0.2, 0.3, 0.4, 0.5 and 0.6 per micron.

In the embodiments of the invention, the spinel crystal fillersdescribed allow for good metal-ion deposition onto an alreadylight-activated pathway (formed in a relatively short period via a laserbeam). In addition, the spinel crystal fillers provide avisible-to-infrared light extinction coefficient to the composite thatprovides functionality in high-speed light activation process (i.e.,‘light activation’ is performed easily with relatively low levels oflight).

In accordance with the invention, the, polymer binder is chosen toprovide important physical properties to the composition and polymercomposite. Beneficial properties include, but are not limited to, goodadhesiveness (i.e., metal adhesion or adhesion to a metal), high and/orlow modulus (depending upon the application), high mechanicalelongation, a low coefficient of humidity expansion (CHE), and hightensile strength.

As with the polymer binder, the spinel crystal filler can also bespecifically selected to provide a polymer composite having awell-defined light-activated pathway after intense light-energy has beenapplied. For example, a well-defined light-activated pathway can moreeasily produce well-defined circuit metal traces after thelight-activated material is submerged in an electroless-plating bath.Metal is typically deposited onto the light-activated portion of thesurface of the polymer composite via an electroless-plating step.

In one embodiment, the polymer compositions of the invention are used toform a multi-layer (at least two or more layers) polymer composite. Themulti-layer polymer composite can be used as at least a portion of aprinted circuit board (“PCB”), chip scale package, wafer scale package,high density interconnect board (HDI), module, “LGA” Land grid array,“SOP” (System-on Package) Module, “QFN” Quad Flat package-No Leads,“FC-QFN” Flip Chip Quad Flat package-No leads, or other similar-typeelectronic substrate. Printed circuit boards (either covered with, orincorporating therein, the polymer composites) may be single sided,double sided, may be incorporated into a stack, or a cable (i.e. aflexible circuit cable). Stacks can include several individual circuitsto form what is commonly referred to as a multi-layer board. Any ofthese types of circuits may be used in a solely flexible or rigidcircuit or, or may be combined to form a rigid/flex or flex/rigidprinted wiring board or cable.

In the case of a three-layer polymer composite, the spinel crystalfiller can be in the outer layers, the inner layer, in at leasttwo-layers, or in all three layers. In addition, the concentration (orloading) of the spinel crystal filler can be different or the same ineach individual layer, depending on the final properties desired.

In one embodiment, electromagnetic radiation (i.e., light-energy via alaser beam) is applied to the surface of the polymer composite. In oneembodiment, a polymer film or composite can be light activated using acommercially available, Esko-Graphics Cyrel® Digital Imager (CDI). Theimager can be operated in a continuous wave mode or can be operated in apulse mode. The purpose of applying this energy, on a particularpredetermined portion of the film, is to light-activate the filmsurface. As defined herein, the term light-activated is defined as aportion of a surface on a polymer composite, wherein a metal ion canbond to the surface in a manner capable of forming a metal circuittrace. If only a small amount of metal is electroless plated onto thelight activated portion of a surface of the film, and is therebyrendered incapable of forming an electrically conductive pathway, thefilm may not be considered as ‘light-activatable’ for purposes herein.

A 50-watt Yttrium Aluminum Garnet (YAG) laser may be employed to lightactivate the polymer composites. However, other types of lasers can beused. In one embodiment, a YAG laser (e.g. Chicago Laser Systems ModelCLS-960-S Resistor Trimmer System) can be used to emit energy between 1and 100 watts, ranging at about 355, 532 or 1064 nm wavelengths light.Generally, the wavelength of the laser light useful to light-activate aportion of the surface of a polymer composite can range from awavelength between and including any two of the following numbers 200nm, 355 nm, 532 nm, 1064 nm, or 3000 nm.

Generally, a laser beam can be modulated using an acousto-opticmodulator/splitter/attenuator device (AOM) and can produce up to 23watts in a single beam. The polymer composites can be held in place byvacuum, or by adhesive (or both), on the outer surface of a drum ormetal plate. A drum-type assembly can rotate the film at speeds rangingfrom 1 to 2000 revolutions per minute in order to reduce productiontime. Spot size (or beam diameter) of the laser beam can be at a focusdistance of from between, and including, any two of the followingnumbers, 1, 2, 4, 6, 8, 10, 15, 20 or 25 microns, typically 18 or 12microns. Average exposures (e.g. energy dose) can be from between, andincluding, any two of the following numbers 0.1, 0.5, 1.0, 2, 4, 6, 8,10, 15 or 20 J/cm². In the examples, at least 4 and 8 J/cm² were used.

A digital pattern of a printed circuit board, known as an image file,can be used to direct light to desired portions (i.e., locations) on thesurface of a polymer composite. Software may be used to storeinformation regarding the location of lines, spaces, curves, pads,holes, and other information such as pad diameter, pad pitch, and holediameter. This data may be stored in digital memory that is readilyaccessible to AOM electronic devices.

The movement of the laser light may be controlled by a computer and isdirected in an organized, predetermined, pixel-by-pixel (orline-by-line) manner across a panel or composite surface. The finefeatures, e.g., less than 100, 75, 50 or 25 microns in line width, of acircuit pattern are inscribed on a surface of the polymer composite. Acombination of light sources, scanning, beam modulation, digital patterntransfer, and mechanical conditions stated above, may all be used toprovide the desired particular circuit pattern.

In one embodiment, metal is subsequently applied to the light-activatedportions of the polymer composites. For these polymer composites, metalcan be plated onto a surface using an ‘electroless’ plating bath in anelectroless-plating step. The plating baths may include a copper ionsource, a reducing agent, an oxidizing agent, and a chelating agent, inaddition to trace amounts of other additives.

Variables that can control the speed and quality in which a plating bathcan plate metal onto a surface of a film include, but are not limited tothe temperature of the plating bath, the amount of surface to be plated,the chemical balance of the solution (e.g., replenishing the platingsolution with a substance that has been consumed), and the degree ofmechanical agitation. The temperature range of a plating bath can becontrolled at a temperature between room temperature and about 70 to 80°C. The temperature can be adjusted according to the type, and amount, ofchelating agent (and other additives) used.

Digitally imaged circuits can be electroless copper plated by using asingle-step or two-step process. First, the polymer compositions orcomposites of the present invention are digitally imaged by a lightactivation step. Light activation debris, or miscellaneous particles,can be removed by mechanical brushing, air or ultra-sonification inorder for a clean electroless copper-plating step to begin. After theseinitial steps have been taken, the light-activated polymer compositionsor composites can be submerged into an electroless copper-plating bathat a plating rate of approximately >3 microns/hour.

The advantages of the present invention are illustrated in the followingnon-limiting Examples. The processing and test procedures used in thepreparation and testing of the composites containing the polymer bindersand spinel crystal fillers are described below.

EXAMPLES

The following examples were prepared from a polymer binder blended witha dispersion of the below mentioned spinel crystal filler.

Example 1

A metal oxide slurry was prepared by first, dissolving 25 grams ofdispersant Disperbyk-192 (a copolymer with pigment affinic groups madeby BYK-Chemie GmbH) in 247.5 grams of acetone in a Netzsch commerciallyavailable media mill. The solvent was stirred at 1000 rpms. 250 grams offine copper chromite spinel, CuCr₂O₄ powders (Shepherd Black 20C980) wasadded and allowed to mix for about 30 minutes. After the above millingprocess, the mean primary particle size in the slurry was measured to be0.664 microns. This is slurry is used in the following samplepreparations.

Sample A: A 10 weight % filled epoxy composition was prepared bydissolving 7.20 grams of Dyhard™ 100SF (used as hardener, aCyanoguanidine with anticaking agent from Degussa AG) and 10.80 grams ofDyhard™ UR500 (used as accelerator, a Carbamide compound from DegussaAG) in 162.00 grams of Epon™ 862 (a Bisphenol-F/Epichlorohydrin epoxyresin from Resolution Performance Products, LLP). The composition ofDyhard™ UR500 consists of >80%N,N″-(4-methyl-m-phenylene)bis(N′,N′-dimethylurea). After the attainmentof a homogeneous and viscous organic medium, 20 grams of thepre-dispersed copper chromite spinel powder slurry was added, and mixedthoroughly by hand or with a commercially available mixer. The abovecomposition was further processed on a three-roll mill to achieve apaste of consistent viscosity and dispersion. The viscosity for thiscomposition was approximately 30-100 Pa·S measured on a Brookfield HBTviscometer using a #5 spindle at 10 rpm and 25° C.

Sample B: A 10 weight % spinel filled epoxy composition was prepared bydissolving 7.12 grams of Dyhard™ 100SF (used as hardener, aCyanoguanidine with anticaking agent from Degussa AG) and 10.68 grams ofDyhard™ UR500 (used as accelerator, a Carbamide compound from DegussaAG) in 160.2 grams of EponIm 862 (a Bisphenol-F/Epichlorohydrin epoxyresin from Resolution Performance Products, LLP). The composition ofDyhard™ UR500 consisted of >80%N,N″-(4-methyl-m-phenylene)bis(N′,N′-dimethylurea). After the attainmentof a homogeneous and viscous organic medium, 20 grams of thepre-dispersed copper chromite spinel powder slurry and 2 grams of soyalecithin (a surfactant from Central Soya Inc.) was added, and mixedthoroughly by hand or a commercially available mixer. The abovecomposition was further processed on a three-roll mill to achieve apaste of consistent viscosity and dispersion. The viscosity for thiscomposition was approximately 30-100 Pa·S measured on a Brookfield HBTviscometer using a #5 spindle at 10 rpm and 25° C.

Sample C: A 10 weight % filled epoxy composition was prepared by usingthe above ingredients: Dyhard™ 100SF, Dyhard™ UR500, Epon™ 862, andpre-dispersed copper chromite spinel slurry. The surfactant was changedto a phosphate ester (RE-610 from Rhone Poulenc Inc) at the amount of,respectively, 7.12 grams, 10.68 grams, 160.2 grams, 20 grams, and 2grams.

Sample D: A 10 weight % filled epoxy composition was prepared by usingthe above ingredients: Dyhard™ 100SF, Dyhard™ UR500, Epon™ 862, andpre-dispersed copper chromite spinel slurry. The surfactant was changedto a defoamer, 2-heptanone (from Eastman Chemicals) in the amount of7.12 grams, 10.68 grams, 160.2 grams, 20 grams, and 2 grams,respectively.

Sample E: Following the above procedure, a 5 weight % filled compositionwas prepared by using the above ingredients of Dyhard™ 100SF, Dyhard™UR500, Epon™ 862, pre-dispersed copper chromite spinel slurry, and soylecithin in the amounts of 7.52 grams, 11.28 grams, 169.2 grams, 10grams, and 2 grams, respectively.

Sample F: A 20 weight % filled epoxy composition was prepared by usingthe above ingredients of Dyhard™ 100SF, Dyhard™ UR500, Epon™ 862,pre-dispersed copper chromite spinel slurry, and soy lecithin in theamounts of 6.32 grams, 9.48 grams, 142.2 grams, 40 grams, and 2 grams,respectively.

Sample G: A 30 weight % filled epoxy composition was prepared by usingthe above ingredients of Dyhard™ 100SF, Dyhard™ UR500, Epon™ 862,pre-dispersed copper chromite spinel slurry, and soy lecithin in theamounts of 5.52 grams, 8.28 grams, 124.2 grams, 60 grams, and 2 grams,respectively.

The above roll-milled paste compositions were separately coated by adoctor blade on a 5-mil thick Kapton® polyimide carrier film to achievea uniform thickness in the range of 2.5 to 3.0 mils without pinholes,bubbles, or other visible defects. These thicker sample films were forDC imaging work. A separate set of thinner coating films was alsoprepared in the range of 0.5 to 2.0 mils with doctor blade for theoptical density (OD) measurement whose data are used to calculate theextinction coefficient for this series of CuCr₂O₄ spinel filled epoxysamples. After settling for 10 minutes, the coated samples were heatedfor 1 hour at 150° C. to complete the curing of the epoxy medium.

The data is summarized in TABLE 1 below. TABLE 1 Filler Example Spinelloading Film Absorption #1 Filled (weight- Thickness coefficientPlateability Sample Epoxy percent) (microns) (alpha) (Y = yes) 1ACuCr₂O₄ 10 13.8 0.1218 Y 2A CuCr₂O₄ 10 19 0.1357 Y 3A CuCr₂O₄ 10 144.40.0616 Y 4B CuCr₂O₄ 10 10.6 0.1694 Y 5B CuCr₂O₄ 10 45.2 0.1167 Y 6BCuCr₂O₄ 10 47 0.1053 Y 7C CuCr₂O₄ 10 13.8 0.1268 Y 8C CuCr₂O₄ 10 12.40.143 Y 9C CuCr₂O₄ 10 41.2 0.1269 Y 10D CuCr₂O₄ 10 55.6 0.1015 Y 11ECuCr₂O₄ 5 14.8 0.0731 Y 12E CuCr₂O₄ 5 32.6 0.0509 Y 13E CuCr₂O₄ 5 46.20.0493 Y 14F CuCr₂O₄ 20 15.4 0.2153 Y 13E CuCr₂O₄ 5 46.2 0.0493 Y 14FCuCr₂O₄ 20 15.4 0.2153 Y 15F CuCr₂O₄ 20 43.6 0.2039 Y 16G CuCr₂O₄ 3021.1 0.3416 Y 17G CuCr₂O₄ 30 12.7 0.3699 Y 18G CuCr₂O₄ 30 16.3 0.3221 Y

When using a DuPont Cyrel Digital Imager, the laser imageability andcopper plateability are summarized below for Samples A-G at anythickness. Energy Dosage (J/cm²) Samples 2 4 6 8 10 A faint good goodgood good B faint good good good good C no faint good good good D faintgood good good good E faint good good good good F good good good goodgood G good good good good good

It is to be understood that although the above examples employ one typeof epoxy resin, the example is exemplary only. The epoxy resin usedrepresents a vast family of various epoxy resins.

Example 2

A metal oxide slurry was prepared by dissolving 25 grams of dispersantDisperbyk-192 (a copolymer with pigment affinic groups made byBYK-Chemie GmbH) in 247.5 grams of acetone in a Netzsch commerciallyavailable media mill. The solvent was stirred at 1000 rpms. 250 grams offine copper chromite spinel, CuCr₂O₄ powders (Shepherd Black 20C980) wasadded and allowed to mix for about 30 minutes. After the above millingprocess, the mean primary particle size in the slurry was measured to be0.664 microns. This slurry is the slurry used in the following samplepreparations.

Bismaleimide/triazine (BT) resins are reaction products of Bismaleimideand dicyanobisphenol A leading to structures containing triazine anddiazine rings. These are sold as BT resins by Mitsubishi Chemical andare classified as a cyanate ester. BT has a Tg of about 195° C. and canprovide an operating temperature of about 160° C. The BT resin solutionacquired for this DC study is consisted of 70 weight % resin and 30weight % Methyl Ethyl Ketone (MEK) as solvent.

In order to raise the viscosity of the BT resin solution, MEK wasevaporated in a fume hood with magnetic stirring at room temperature.The choice of room temperature evaporation was to assure no undesirablethermal effect to change the physical and chemical nature of the BTresin in the as-received solution. A 20.5 hour evaporation removed 7.03weight % MEK to provide a 75.29 weight % BT resin solution. This processwas found to increase the viscosity of BT resin solution to obtain afilled BT of adequate viscosity for more acceptable coating for digitalcircuitry imaging.

Three compositions, H, I, and J, were made to provide 5, 10, and 20weight % CuCr₂O₄ spinel in BT resin. The actual amounts were calculatedwith the needed BT resin quantity after deducting the volatile MEKsolvent which should be nearly completely removed after the subsequentstep of solvent drying at 80° C. CuCr₂O₄ spinel powders were easilydispersed in the BT resin solution and suitable methods for mixinginorganic materials with organic binder solutions were used. Due to thehigh volatility of the solvent MEK used in the BT resin solution,however, the dispersion apparatus/method should provide full orsemi-enclosure of the treated materials to minimize the loss of MEKwhich will raise the overall viscosity and/or form surface skin.Specific sample preparation procedures are described below.

Sample H: 50 grams of 5 weight % CuCr₂O₄ spinel in BT resin compositionwas prepared by mixing 2.50 grams of the above CuCr₂O₄ spinel powderslurry in 63.09 grams of the previously concentrated BT resin solution(with 75.29 weight % BT resin in MEK). Although the total amount of theadded ingredients was 65.59 grams, after discounting the volatile MEKsolvent, the remaining CuCr₂O₄ spinel and BT resin yielded the specifiedquantity of 50 grams.

Sample I: 50 grams of 10 weight % CuCr₂O₄ spinel in BT resin compositionwas prepared by mixing 5.00 grams of the above CuCr₂O₄ spinel powderslurry in 59.77 grams of the previously concentrated BT resin solution(with 75.29 weight % BT resin in MEK). Although the total amount of theadded ingredients was 64.77 grams, after discounting the volatile MEKsolvent, the remaining CuCr₂O₄ spinel and BT resin yielded the specifiedquantity of 50 grams.

Sample J: 50 grams of 20 weight % CuCr₂O₄ spinel in BT resin compositionwas prepared by mixing 10.00 grams of the above CuCr₂O₄ spinel powderslurry in 53.13 grams of the previously concentrated BT resin solution(with 75.29 weight % BT resin in MEK). Although the total amount of theadded ingredients was 63.13 grams, after discounting the volatile MEKsolvent, the remaining CuCr₂O₄ spinel slurry and BT resin yielded thespecified quantity of 50 grams.

A parallel group of three compositions, K, L and M, were also preparedto provide 5, 20, and 30 weight % CuCr₂O₄ spinel in BT resin with theaddition of 1 weight % soya lecithin as a surfactant. The actual amountswere calculated with the needed BT resin quantity after deducting thevolatile MEK solvent which should be nearly completely removed after thesubsequent step of solvent drying at 80 degrees C. To maintain thedesired weight % of CuCr₂O₄ spinel, the soya lecithin surfactant wasadded at the expense of the BT resin. Specific sample preparationprocedures are described below.

Sample K: 50 grams of 5 weight % CuCr₂O₄ spinel in BT resin compositionwas prepared by mixing 2.50 grams of the above CuCr₂O₄ spinel powderslurry in 62.42 grams of the previously concentrated BT resin solution(with 75.29 weight % BT resin in MEK) and 0.5 grams of soya lecithin assurfactant. Although the total amount of the added ingredients was 65.42grams, after discounting the volatile MEK solvent, the remaining CuCr₂O₄spinel and BT resin yielded the specified quantity of 50 grams.

Sample L: 50 grams of 20 weight % CuCr₂O₄ spinel in BT resin compositionwas prepared by mixing 10.00 grams of the above CuCr₂O₄ spinel powderslurry in 52.46 grams of the previously concentrated BT resin solution(with 75.29 weight % BT resin in MEK) and 0.5 grams of soya lecithin assurfactant. Although the total amount of the added ingredients was 62.96grams, after discounting the volatile MEK solvent, the remaining CuCr₂O₄spinel and BT resin yield the specified quantity of 50 grams.

Sample M: 50 grams of 30 weight % CuCr₂O₄ spinel in BT resin compositionwas prepared by mixing 15.00 grams of the above CuCr₂O₄ spinel powderslurry in 45.82 grams of the previously concentrated BT resin solution(with 75.29 weight % BT resin in MEK) and 0.5 grams of soya lecithin assurfactant. Although the total amount of the added ingredients was 61.32grams, after discounting the volatile MEK solvent, the remaining CuCr₂O₄spinel and BT resin yield the specified quantity of 50 grams.

For DC imaging work, a one millimeter thick copper foil was used as acarrier layer. The above H to M compositions were separately coated by adoctor blade to achieve a uniform thickness in the range of 2.5 to 3.0mils without pinholes, bubbles, or other visible defects. After settlingfor 10 minutes, the coated samples were heated for 1 hour at 80° C. toevaporate the MEK solvent contained in the BT resin solution, followedby a 90 minute curing at 200° C. of the BT resin as recommended by themanufacturer.

A separate set of thinner coating films were also prepared in the rangeof 0.5 to 2.0 mils on a 5-mil thick Kapton® polyimide carrier film withdoctor blade for the optical density (OD) measurement whose data areused to calculate the extinction coefficient for this series of CuCr₂O₄spinel filled BT samples.

The data for the spinel-filled BT resin is summarized in Table 2 below.TABLE 2 Spinel Filler Example Filled loading Film AbsorptionPlateability #2 BT (weight- Thickness coefficient (Y = yes, Sample resinpercent) (microns) (alpha) N = no) 19H CuCr₂O₄ 5 28.2 0.0282 N 20ICuCr₂O₄ 10 21.4 0.0533 Y 21J CuCr₂O₄ 20 20 0.082 Y 22K CuCr₂O₄ 5 27.40.0295 N 23L CuCr₂O₄ 20 24.4 0.0904 Y 24M CuCr₂O₄ 30 25.3 0.1233 Y 25MCuCr₂O₄ 30 27.8 0.1224 YFor Table 1 and Table 2, assuming no light scattering,I_(x)=I_(o)*e^((−α) ^(+x)); T=I_(x)/I_(o)=10^((−OD))=e^((−α) ⁺ ^(x));a=−[LN(10(−OD))]/x; and OD=−LOG(T).

When using a DuPont Cyrel Digital Imager, the laser imageability andcopper plateability are summarized below for Samples I, J, L, and M(Workable examples) and H, and K (Comparative examples).

Workable Examples

Energy Dosage (J/cm²) Sample 4 6 8 10 15 20 I faint faint good good fairfair J fair fair good good good good L fair good good good good fair Mfair good good good good good

Comparative Examples

Energy Dosage (J/cm²) Sample 4 6 8 10 15 20 H no no no no no no K no nono no no no

The polymer composites formed may be used to make circuits having fineelectrically conductive pathways. The fine electrically conductivepathways may be formed using an electro-less metal plating step. Afterlight-activating the surface of the composite with a laser beam, forexample, the light activated portions are plated to form thin lines, orpathways, on the surface of the polymer compositions or composites.

Without wishing to be held to any particular theory of the presentinvention, at least in some embodiments of the present invention, it isbelieved that the amplified light (e.g., laser) substantially, if notcompletely, volatilizes away the polymeric continuous domain, leavingexposed the discontinuous spinel crystal type domains. The heattreatment and sudden exposure to ambient conditions (of the spinelcrystals) caused by the amplified light, appears to prepare the crystalsto receive metallization processing.

In the foregoing specification, the invention has been described withreference to specific embodiments. However, one of ordinary skill in theart appreciates that various modifications and changes can be madewithout departing from the scope of the invention as set forth in theclaims below. Accordingly, the specification and figures are to beregarded in an illustrative rather than a restrictive sense and all suchmodifications are intended to be included within the scope of invention.

Benefits, other advantages, and solutions to problems have beendescribed above with regard to specific embodiments. For example,advantages include the formation of fine line features, thesimplification of the manufacturing process of making circuits on boardsas compared to a lithographic process of forming copper patterns onsubstrates, the ability to process reel-to-reel at the laser imagingstep, in addition to the plating step, as opposed to a panel-to-panelbatch processing method. However, the benefits, advantages, solutions toproblems, and any element(s) that may cause any benefit, advantage, orsolution to occur or become more pronounced are not to be construed as acritical, required, or essential feature or element of any or all theclaims.

1. A light-activatable polymer composition comprising: A. a polymerbinder selected from a group consisting of: epoxy resins, silica filledepoxy, bismaleimide resins, bismaleimide triazines, fluoropolymers,polyesters, polyphenylene oxide/polyphenylene ether resins,polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquidcrystal polymers, polyamides, cyanate esters, or combinations thereof,the polymer binder being present in an amount from 40, 45, 50, 55, 60,65, 70, 75, 80, 85, 90, 95, 96, or 97 weight-percent of the total weightof the polymer composition; and B. a spinel crystal filler present in anamount from 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35,40, 45, 50, 55 and 60 weight-percent of the total weight of the polymercomposition.
 2. The polymer composition of claim 1, wherein thecomposition has a visible-to-infrared light extinction coefficientbetween and including any two of the following numbers 0.05, 0.06, 0.07,0.08, 0.09, 0.1, 0.2, 0.3, 0.4, 0.5, and 0.6 per micron.
 3. Thecomposition of claim 1 wherein the spinel crystal filler is representedby the chemical formula AB₂O₄.
 4. The composition of claim 1 wherein thespinel crystal filler is represented by the chemical formula BABO₄. 5.The composition of claims 3 or 4 wherein A is a metal cation having avalence of 2 and is selected from the group consisting of cadmium, zinc,copper, cobalt, magnesium, tin, titanium, iron, aluminum, nickel,manganese, chromium, and combinations of two or more of these.
 6. Thecomposition of claims 3 or 4 wherein B is a metal cation having avalence of 3 and is selected from the group consisting of cadmium,manganese, nickel, zinc, copper, cobalt, iron, magnesium, tin, titanium,aluminum, chromium, and combinations of two or more of these.
 7. Thecomposition of claims 3 or 4 wherein A is an element from the periodictable selected from the group consisting of cadmium, chromium,manganese, nickel, zinc, copper, cobalt, iron, magnesium, tin, titanium,and combinations of two or more of these.
 8. The composition of claims 3or 4 wherein B is an element from the periodic table selected from thegroup consisting of chromium, iron, aluminum, nickel, manganese, tin,and combinations of two or more of these.
 9. The composition of claim 1wherein the spinel crystal filler has an average particle size betweenand including any two of the following numbers 50, 100, 300, 500, 800,1000, 2000, 3000, 4000, 5000 and 10000 nanometers.
 10. The compositionof claim 1, wherein the composition is impregnated into a glassstructure to form a prepreg.
 11. The composition of claim 1, wherein thecomposition is impregnated into a fiber structure.
 12. The compositionof claim 1, wherein the composition is in the form of a film.
 13. Thecomposition of claim 12, wherein the film has a thickness between andincluding any two of the following numbers 1, 2, 3, 4, 5, 7, 8, 9, 10,12, 14, 16, 18, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85,90, 95, 100, 125, 150, 175 and 200 microns.
 14. The composition of claim1, wherein the polymer binder is an epoxy resin.
 15. The composition ofclaim 1, wherein the polymer binder is bismaleimide triazine orbismaleimide resin.
 16. The composition of claim 1, wherein the polymerbinder is a fluoropolymer.
 17. The composition of claim 1, wherein thepolymer binder is a polyester.
 18. The composition of claim 1, whereinthe polymer binder is a liquid crystal polymer.
 19. The composition ofclaim 1, wherein the polymer binder is a polyamide.
 20. The compositionof claim 1, wherein the polymer binder is a cyanate ester.
 21. Thepolymer composite of claim 1, further comprising a metal layer whereinthe metal layer is adjacent to the polymer composite.
 22. A single-layerlight-activatable polymer composite, comprising a polymer compositioncomprising at least 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96,or 97 weight-percent of a polymer binder selected from the groupconsisting of epoxy resins, silica filled epoxy, bismaleimide resins,bismaleimide triazines, fluoropolymers, polyesters, polyphenyleneoxide/polyphenylene ether resins, polybutadiene/polyisoprenecrosslinkable resins (and copolymers), liquid crystal polymers,polyamides, cyanate esters, or combinations thereof, the weight percentof the polymer binder being based on the total weight of the polymercomposition; and, at least 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15,20, 25, 30, 35, 40, 45, 50, 55 or 60 weight-percent spinel crystalfiller based on the total weight of the polymer composition.
 23. Thepolymer composite of claim 22, wherein the single-layer has avisible-to-infrared light extinction coefficient between and includingany two of the following numbers 0.05, 0.06, 0.07, 0.08, 0.09, 0.1, 0.2,0.3, 0.4, 0.5, and 0.6 per micron.
 24. The polymer composite of claim22, further comprising a metal layer wherein the metal layer is adjacentto the polymer composite.
 25. The polymer composite of claim 22, whereinthe polymer binder is an epoxy resin.
 26. The polymer composite of claim22, wherein the polymer binder is bismaleimide triazine or bismaleimideresin.
 27. The polymer composite of claim 22, wherein the polymer binderis a fluoropolymer.
 28. The polymer composite of claim 22, wherein thepolymer binder is a polyester.
 29. The polymer composite of claim 22,wherein the polymer binder is a liquid crystal polymer.
 30. The polymercomposite of claim 22, wherein the polymer binder is a polyamide. 31.The polymer composite of claim 22, wherein the polymer binder is acyanate ester.
 32. A two-layer light-activatable polymer compositecomprising a first layer and a second layer; the first layer comprisinga polymer composition comprising at least 40, 45, 50, 55, 60, 65, 70,75, 80, 85, 90, 95, 96, or 97 weight-percent of a polymer binderselected from the group consisting of epoxy resins, silica filled epoxy,bismaleimide resins, bismaleimide triazines, fluoropolymers, polyesters,polyphenylene oxide/polyphenylene ether resins,polybutadiene/polyisoprene crosslinkable resins (and copolymers), liquidcrystal polymers, polyamides, cyanate esters, or combinations thereof,the weight percent of the polymer binder based on the total weight ofthe polymer composition used in the first layer; and, at least 3, 4, 5,6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40, 45, 50, 55 or 60weight-percent spinel crystal filler based on the total weight of thepolymer composition used in the first layer, the second layer comprisinga functional layer.
 33. The polymer composite of claim 32, wherein thefirst layer is in the form of a film.
 34. The polymer composite of claim32, wherein the first layer is in the form of a prepreg.
 35. The polymercomposite of claim 32, further comprising a metal layer wherein themetal layer is adjacent to the second layer.
 36. The polymer compositeof claim 32, wherein the first layer has a visible-to-infrared lightextinction coefficient between and including any two of the followingnumbers 0.05, 0.06, 0.07, 0.08, 0.09, 0.1, 0.2, 0.3, 0.4, 0.5, and 0.6per micron.
 39. The polymer composite of claim 32, wherein the secondlayer is a thermal conduction layer.
 40. The polymer composite of claim32, wherein the second layer is a capacitor layer.
 41. The polymercomposite of claim 32, wherein the second layer is a resistor layer. 42.The polymer composite of claim 32, wherein the second layer is adimensionally stable dielectric layer.
 43. The polymer composite ofclaim 32, wherein the second layer is an adhesive layer.
 44. The polymercomposite of claim 32, wherein the second layer is in the form of afilm.
 45. The polymer composite of claim 32, wherein the second layer isin the form of a prepreg.
 46. A three-layer light-activatable polymercomposite comprising two outer layers adjacent to an inner layer; theinner layer positioned between the two outer layers, wherein at leastone outer layers comprises a polymer composition comprising at least 40,45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95, 96 or 97 weight-percent of apolymer binder selected from the group consisting of epoxy resins,silica filled epoxy, bismaleimide resins, bismaleimide triazines,fluoropolymers, polyesters, polyphenylene oxide/polyphenylene etherresins, polybutadiene/polyisoprene crosslinkable resins (andcopolymers), liquid crystal polymers, polyamides, cyanate esters, orcombinations thereof, the weight percent of the polymer binder based onthe total weight of the polymer composition of the outer layer; and, atleast 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 20, 25, 30, 35, 40,45, 50, 55 or 60 weight-percent spinel crystal filler based on the totalweight of the polymer composition of the outer layer, and wherein in theinner layer comprises a functional layer.
 47. The polymer composite ofclaim 44, wherein at least one of the outer layers is in the form of afilm or prepreg.
 48. The polymer composite of claim 44, furthercomprising a metal layer wherein the metal layer is adjacent to the oneouter layer or both outer layers.
 49. The polymer composite of claim 44,further comprising a metal layer wherein the metal layer is adjacent tothe polymer composite.
 50. A process for making a light-activatablepolymer composite, comprising the steps of: A. dispersing a spinelcrystal filler in an organic solvent, wherein the average particle sizeof the spinel crystal filler is between any two of the following numbers50, 100, 300, 500, 800, 1000, 2000, 3000, 4000, 5000 and 10000nanometers to form a dispersion, B. combining the dispersion with apolymer binder selected from the group consisting of epoxy resins,silica filled epoxy, bismaleimide resins, bismaleimide triazines,fluoropolymers, polyesters, polyphenylene oxide/polyphenylene etherresins, polybutadiene/polyisoprene crosslinkable resins (andcopolymers), liquid crystal polymers, polyamides, cyanate esters, orcombinations thereof, to form a composition, C. applying the compositiononto a portion of a flat surface to form a layer, and D. applyingthermal energy to the layer to form a polymer composite.
 51. The processof claim 48, wherein the polymer composite has a visible-to-infraredlight extinction coefficient between and including any two of thefollowing numbers 0.05, 0.06, 0.07, 0.08, 0.09, 0.1, 0.2, 0.3, 0.4, 0.5,and 0.6 per micron.
 52. The process of claim 48, further comprising thesteps of: A. light-activating a portion of the polymer composite with alaser beam to form light activated portions on a surface of thecomposite, and B. metal plating the light activated portions of thepolymer composite using at least one electroless plating bath to formelectrically conductive pathways on the light activated portions.
 53. Acircuit board incorporating the composition of claim
 1. 54. Thecomposition of claim 1, incorporated into a component selected from anintegrated circuit package, an interconnect in a pin grid array, amulti-chip module, a chip-scale package, a ball grid array, a radiofrequency module, a digital module, chip-on-flex, a stacked viasubstrate, a printed circuit board having embedded passive devices, ahigh density interconnect circuit board, an “LGA” Land grid array, an“SOP” (System-on Package) Module, a “QFN” Quad Flat package-No Leads,and a “FC-QFN” Flip Chip Quad Flat package-No leads, a component used ina high density interconnect, including a wafer scale package, a tapeautomated bonding circuit package, a chip-on-flex circuit package, or achip-on-board electronic circuit package.
 55. The composition of claim1, further comprising an additive selected from the group consisting ofan antioxidant, a light stabilizer, a light extinction coefficientmodifier, a flame retardant additive, an anti-static agent, a heatstabilizer, a reinforcing agent, an ultraviolet light absorbing agent,an inorganic filler, a surfactant or dispersing agent, or a combinationthereof.
 56. The composition of claim 53, wherein the inorganic filleris selected from the group consisting of silica and alumina.
 57. Thecomposition of claim 53, wherein the light extinction coefficientmodifier is a carbon powder or graphite powder.
 58. A laminatecomprising the composition of claim 1 and a metal foil wherein thecomposition is coated as a liquid or paste onto the metal foil.
 59. Alaminate comprising the composition of claim 1 and a metal layer whereinthe metal layer is deposited onto the composition by either anelectroless plating or electrolytic plating method.